Printed circuit board welding methods and techniques
Printed circuit board welding techniques and techniques of welding. 1, the role of tin When hot liquid solder dissolves and penetrates the surface of the metal to be welded, it is called the metal dip or metal is tin. The formation of a new part of the solder-copper mixture of molecules is copper, part of which is an alloy of solder. This solvent effect is called tinting, and it forms intermolecular bonds between the various parts to form a metal-alloy compound. The formation of a good intermolecular bond is the heart of the welding process, which determines the strength and quality of the weld. Only the surface of the copper is free from contamination, the oxide film that is not exposed to the air is allowed to dip and the solder and the working surface need to reach the proper temperature.